RoHS Information
Cisco's EU RoHS Position Statement
Material Use
Cisco's Product Stewardship program includes policies and procedures for hazardous materials that are either restricted by global product-related environmental laws, regulations, or by our customers. Cisco is actively working with engineers, suppliers, and industry peers to reduce the concentration and quantity of hazardous substances in our products. The key objectives of our program are to:
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Reduce the number and quantity of hazardous substances (such as lead solder in networking equipment, which is currently exempted from the European Union Restriction RoHS Directive) while ensuring Cisco's high product quality and reliability standards continue to be met. This will be achieved through the development and deployment of Pb-free solder qualification guidelines for components, interconnects, and PCB reliability. Cisco will continue to work with industry consortia to define common qualification criteria.
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Comply with product-related environmental laws and regulations restricting the use of certain hazardous substances worldwide.
Specific substances of concern and regulation include the 'RoHS' substances Lead (Pb), Mercury (Hg), Cadmium (Cd), hexalvalent Chromium (Cr+6), Polybrominated biphenyls (PBB) and Polybrominated diphenylethers (PBDE), which are restricted from use in products shipped into the EU/EEA and Switzerland as of July 1st, 2006.
BFRs and PVC
Brominated flame retardants (BFRs) and polyvinyl chloride (PVC) are included in Cisco’s controlled substances specification, a key element of our hazardous substance management policy. Cisco is working with industry standards technical committees on the implications of substituting for BFRs and PVC in our products. We are also evaluating the impact to our supply chain and product integrity. That examination includes:
- Evaluation of halogen-free printed circuit board material and electrical properties critical to the performance of the printed circuit assemblies used in Cisco products
- Qualification of halogen-free printed circuit board laminates and assemblies in lead-free manufacturing, specifically to ensure they perform well through elevated lead-free reflow temperatures
- Evaluation of halogen-free plastics used on connector housings to ensure they perform appropriately through elevated lead-free reflow temperatures