Cisco Embedded Service 2020 Series Switches Hardware Technical Guide

Available Languages

Download Options

  • PDF     (2.3 MB)
    View with Adobe Reader on a variety of devices
Updated:June 15, 2018

Bias-Free Language

The documentation set for this product strives to use bias-free language. For the purposes of this documentation set, bias-free is defined as language that does not imply discrimination based on age, disability, gender, racial identity, ethnic identity, sexual orientation, socioeconomic status, and intersectionality. Exceptions may be present in the documentation due to language that is hardcoded in the user interfaces of the product software, language used based on RFP documentation, or language that is used by a referenced third-party product. Learn more about how Cisco is using Inclusive Language.

Table of Contents

Cisco Embedded Service 2020 Series Switches HardwareTechnical Guide

Contents

Overview

Audience

Main Board Layout and Dimensions

Expansion Board Layout and Dimensions

Interface Connectors

Main Board Interface Connectors

ESS-2020 (Main Board) Ethernet I/O Connector (P13)

ESS-2020 (Main Board) Digital I/O, Console, and Power Connector (P15)

ESS-2020 (Main Board) Port Expansion Connector (P22)

ESS-2020-16TC (Expansion Board) Interface Connectors

ESS-2020-16TC (Expansion Board) Ethernet I/O Connector (P10)

ESS-2020-16TC (Expansion Board) Power Connector (P11)

ESS-2020-16TC (Expansion Board) Port Expansion Connector (P22)

Board to Board Connectors

LED Definitions

Mechanical and Environmental Testing

Factory Default Feature

Important Notice about Zeroization

Overtemperature Detection

Thermal Design Considerations

Models with Thermal Plate

Models Without Thermal Plate

Validating a Thermal Solution

Mounting Options for the Cisco-Designed Thermal Plate

Sandwich Configuration

Product Specifications

Power Requirements

SFP Support

Regulatory Compliance and Safety Information

Statement 8000—Standards Compliance

Obtaining Documentation and Submitting a Service Request

Cisco Embedded Service 2020 Series Switches Hardware Technical Guide

Models: ESS-2020-CON, ESS-2020-NCP, ESS-2020-16TC-CON, ESS-2020-16TC-NCP

Published March 2018

Revised February 2021

This hardware technical guide provides a product description, specifications, and compliance information for the Cisco Embedded Service 2020 Series Switches.

note.gif

Noteblank.gif The documentation set for this product strives to use bias-free language. For purposes of this documentation set, bias-free is defined as language that does not imply discrimination based on age, disability, gender, racial identity, ethnic identity, sexual orientation, socioeconomic status, and intersectionality. Exceptions may be present in the documentation due to language that is hardcoded in the user interfaces of the product software, language used based on RFP documentation, or language that is used by a referenced third-party product.

Contents

This guide is organized into the following sections:

Overview

The Cisco ESS 2020 is an embedded Ethernet switch card family that conforms to the PC104 form factor board size. The compact design simplifies integration and offers system integrators the ability to use the Cisco ESS 2020 in a wide variety of applications. The Cisco ESS 2020 consists of a main board and an optional expansion board. Both the main board and the expansion board are available with Cisco-designed cooling plates, and are also available without the cooling plates for system integrators who want to design their own custom thermal solutions.

Table 1 provides the hardware product IDs and brief descriptions for the boards.

 

Table 1 Cisco ESS 2020 Models
Model
Description
Software Image

ESS-2020-CON

Embedded Service Switch Main Board (with conduction cooling plate), 2GE (copper or fiber), 8FE, console

LAN Lite

Can upgrade to LAN Base

ESS-2020-NCP

Embedded Service Switch Main Board (no cooling plate), 2GE (copper or fiber), 8FE, console

LAN Lite

Can upgrade to LAN Base

ESS-2020-16TC-CON

Embedded Service Switch Expansion Board (with conduction cooling plate), 16FE

 

ESS-2020-16TC-NCP

Embedded Service Switch Expansion Board (no cooling plate), 16FE

 
note.gif

Noteblank.gif Refer to the Cisco ESS 2020 data sheet for a complete list of available product IDs.

note.gif

Noteblank.gif When using the console connection, it is important to not press the break key too early during boot. You should only press the break key when the image begins to load (you will see pound signs). Failure to wait will not allow the break key to work.

Audience

This guide is for system integrators who are integrating the Cisco ESS 2020 into a custom end product.

Main Board Layout and Dimensions

Figure 1 and Figure 2 show the layout and dimensions of the main board that is not equipped with the Cisco-designed cooling plate (ESS-2020-NCP).

Figure 1 ESS-2020-NCP (Main Board Without the Cooling Plate)—Top and Side Views

 

346645.eps
note.gif

Noteblank.gif Dimensions in inches. Tolerances (unless otherwise stated):.XX +/- 0.010,.XXX +/- 0.005

Figure 2 ESS-2020-NCP (Main Board Without Cooling Plate)—Bottom View

 

347582.eps
note.gif

Noteblank.gif Dimensions in inches. Tolerances (unless otherwise stated):.XX +/- 0.010,.XXX +/- 0.005

Figure 3 and Figure 4 show the layout and dimensions of the main board that is equipped with the Cisco-designed cooling plate (ESS-2020-CON).

Figure 3 ESS-2020-CON (Main Board with Cooling Plate) —Top and Side Views

 

346702.eps
note.gif

Noteblank.gif Dimensions in inches. Tolerances (unless otherwise stated):.XX +/- 0.010,.XXX +/- 0.005

Figure 4 ESS-2020-CON (Main Board with Cooling Plate) —Bottom View

 

347586.eps

 

note.gif

Noteblank.gif Dimensions in inches. Tolerances (unless otherwise stated):.XX +/- 0.010,.XXX +/- 0.005

Expansion Board Layout and Dimensions

Figure 5 and Figure 6 show the layout and dimensions of the expansion board that is not equipped with the Cisco-designed cooling plate (ESS-2020-16TC-NCP).

note.gif

Noteblank.gif Compared to the PC104 specification, the corner mounting holes are mirrored. This design allows the expansion card to be mounted upside-down to an I/O board that is also mated to the base card in a “sandwich configuration.” For more information, see Sandwich Configuration.

Figure 5 ESS-2020-16TC-NCP (Expansion Board Without Cooling Plate) — Bottom and Side View

 

346650.eps
note.gif

Noteblank.gif Dimensions in inches. Tolerances (unless otherwise stated):.XX +/- 0.010,.XXX +/- 0.005

Figure 6 ESS-2020-16TC-NCP (Expansion Board Without Cooling Plate) — Top View

 

347584.eps

 

Figure 8 and Figure 7 show the layout and dimensions of the expansion board that is equipped with the Cisco-designed cooling plate (ESS-2020-16TC-CON).

Figure 7 ESS-2020-16TC-CON (Expansion Board with Cooling Plate)—Top and Side Views

 

 

347581.eps
note.gif

Noteblank.gif Dimensions in inches. Tolerances (unless otherwise stated):.XX +/- 0.010,.XXX +/- 0.005

Figure 8 ESS-2020-16TC-CON (Expansion Board with Cooling Plate)—Bottom and Side View

 

346703.eps
note.gif

Noteblank.gif Dimensions in inches. Tolerances (unless otherwise stated):.XX +/- 0.010,.XXX +/- 0.005

Interface Connectors

The main board and the expansion board each have three connectors that provide power and interface connections to external devices and to each other. All of the connectors belong to the Free Height family of connectors from TE Connectivity. Depending on the mating connector selected by the integrator, a stacking height of 7 mm, 11 mm, or 15 mm can be achieved. See the “Board to Board Connectors” section for additional information on connector stacking height and selecting compatible connectors.

Main Board Interface Connectors

The locations and designations of the three main board interface connectors are shown in Figure 9.

Figure 9 ESS-2020 (Main Board) Connectors

 

346648.eps

 

ESS-2020 (Main Board) Ethernet I/O Connector (P13)

The main board Ethernet I/O connector (P13) is a TE Connectivity 1-5179030-3 80-pin connector. Table 2 provides a pinout listing for the Ethernet I/O connector. See Figure 9 for the pin numbering convention.

 

Table 2 Cisco ESS-2020 (Main Board) Ethernet I/O Connector (P13) Pinout

Odd Pin Number
Signal Name
Even Pin Number
Signal Name

1

GND

 

2

NC (unused)

3

SFP_GE1/2_RX+

 

4

ETH_GE1/2_TRD0+

5

SFP_GE1/2_RX-

 

6

ETH_GE1/2_TRD0-

7

GND

 

8

ETH_GE1/2_TRD1+

9

SFP_GE1/2_TX+

 

10

ETH_GE1/2_TRD1-

11

SFP_GE1/2_TX-

 

12

ETH_GE1/2_TRD2+

13

GND

 

14

ETH_GE1/2_TRD2-

15

SFP_GE1/1_RX-

 

16

ETH_GE1/2_TRD3+

17

SFP_GE1/1_RX+

 

18

ETH_GE1/2_TRD3-

19

GND

 

20

NC (unused)

21

SFP_GE1/1_TX-

 

22

ETH_GE1/1_TRD0+

23

SFP_GE1/1_TX+

 

24

ETH_GE1/1_TRD0-

25

GND

 

26

ETH_GE1/1_TRD1+

27

NC (unused)

 

28

ETH_GE1/1_TRD1-

29

NC (unused)

 

30

ETH_GE1/1_TRD2+

31

Chassis_GND

 

32

ETH_GE1/1_TRD2-

33

Chassis_GND

 

34

ETH_GE1/1_TRD3+

35

Chassis_GND

 

36

ETH_GE1/1_TRD3-

37

NC (unused)

 

38

NC (unused)

39

NC (unused)

 

40

NC (unused)

41

ETH_FE1/7_TX-

 

42

ETH_FE1/8_TX-

43

ETH_FE1/7_TX+

 

44

ETH_FE1/8_TX+

45

ETH_FE1/7_RX-

 

46

ETH_FE1/8_RX-

47

ETH_FE1/7_RX+

 

48

ETH_FE1/8_RX+

49

NC (unused)

 

50

NC (unused)

51

ETH_FE1/5_TX-

 

52

ETH_FE1/6_TX-

53

ETH_FE1/5_TX+

 

54

ETH_FE1/6_TX+

55

ETH_FE1/5_RX-

 

56

ETH_FE1/6_RX-

57

ETH_FE1/5_RX+

 

58

ETH_FE1/6_RX+

59

NC (unused)

 

60

NC (unused)

61

ETH_FE1/3_TX-

 

62

ETH_FE1/4_TX-

63

ETH_FE1/3_TX+

 

64

ETH_FE1/4_TX+

65

ETH_FE1/3_RX-

 

66

ETH_FE1/4_RX-

67

ETH_FE1/3_RX+

 

68

ETH_FE1/4_RX+

69

NC (unused)

 

70

NC (unused)

71

ETH_FE1/1_TX-

 

72

ETH_FE1/2_TX-

73

ETH_FE1/1_TX+

 

74

ETH_FE1/2_TX+

75

ETH_FE1/1_RX-

 

76

ETH_FE1/2_RX-

77

ETH_FE1/1_RX+

 

78

ETH_FE1/2_RX+

79

NC (unused)

 

80

NC (unused)

The following are guidelines for the P13 connector:

  • The main board has Ethernet transformers for the copper Gigabit Ethernet 1/1-2 transmit/receive signal pairs (designated ETH_GE*). In 1000BASE-T mode, all pairs transmit and receive; for 10/100BASE-T, TRD0+/- typically transmits and TRD1+/- typically receives.
  • Serial Gigabit Media Independent Interface (SGMII) signals are intended for connection to approved SFP transceivers. See Table 19 for a list of supported SFP transceivers.
  • The Chassis_GND signal is not electrically connected to the GND signal on the main board. Chassis_GND is used as the termination for the center taps on the main board Ethernet magnetics. You should either connect or not connect these signals together as required for your specific application.
  • The main board contains Ethernet transformers for all of the FastEthernet ports 1/1–8 transmit/receive pairs (signals designated ETH_FE*).

ESS-2020 (Main Board) Digital I/O, Console, and Power Connector (P15)

The digital I/O, console, and power connector (P15) is a TE Connectivity 7-5177986-2 60-pin connector. Table 3 provides a pinout listing for the connector. See Figure 9 for the pin numbering convention.

 

Table 3 Cisco ESS-2020 (Main Board) Digital I/O, Console, and Power Connector (P15) Pinout

Pins
Signal Name
Direction
Technology/
Threshold 1
Description

1–4, 6

+3.3 VDC

—

PWR

—

5, 22, 24, 25

NC (unused)

—

—

—

7–12, 18–20, 27, 29–31, 34, 36, 46, 47, 53, 54, 59, 60

GND

—

GND

Ground.

13, 15, 17, 21, 23

+5 VDC

—

PWR

—

42, 43, 44, 45, 49, 51, 55, 57

Reserved

 

 

Leave these pins unconnected.

14

SFP_GE1/1_I2C_SDA

I/O

3.3V LVTTL thresholds, OD, PU

I2C data signal intended for connection to MOD-DEF2 pin of standard SFP module connector corresponding to Gigabit Ethernet 1/1.2

16

SFP_GE1/2_I2C_SDA

I/O

3.3V LVTTL thresholds, OD, PU

I2C data signal intended for connection to MOD-DEF2 pin of standard SFP module connector corresponding to GigabitEthernet 1/2.2

26

SFP_GE1/2_TXFLT

I

3.3V LVTTL thresholds, PU

Transmit fault signal from standard SFP module corresponding to GigabitEthernet 1/2.

  • Logic low: Normal operation
  • Logic high: Laser fault detected

28

SFP_GE1/1_TXDSBL

O

3.3V LVTTL thresholds

Transmit disable signal to standard SFP module corresponding to GigabitEthernet 1/1.

  • Logic low: Normal operation
  • Logic high: Disable SFP module transmitter

32

SFP_GE1/2_TXDSBL

O

3.3V LVTTL thresholds

Transmit disable signal to standard SFP module corresponding to GigabitEthernet 1/2.

  • Logic low: Normal operation
  • Logic high: Disable SFP module transmitter

33

SFP_GE1/1_TXFLT

I

3.3V LVTTL thresholds, PU

Transmit fault signal from standard SFP module corresponding to GigabitEthernet 1/1.

  • Logic low: Normal operation
  • Logic high: Laser fault detected

35

SFP_GE1/1_PRES_L

I

3.3V LVTTL thresholds, PU

SFP module presence signal intended for connection to MOD-DEF0 pin of standard SFP module connector corresponding to GigabitEthernet 1/1.

  • Logic low: Module present
  • Logic high: Module not present

37

SFP_GE1/2_PRES_L

I

3.3V LVTTL thresholds, PU

SFP module presence signal intended for connection to MOD-DEF0 pin of standard SFP module connector corresponding to GigabitEthernet 1/2.

  • Logic low: Module present
  • Logic high: Module not present

38

SFP_GE1/1_RXLOS

I

3.3V LVTTL thresholds, PU

Loss of signal indication from standard SFP module corresponding to GigabitEthernet 1/1.

  • Logic low: Normal operation
  • Logic high: Optical receive strength too low

39

LED_EXP_I2C_SDA

I/O

3.3V LVTTL thresholds, OD, PU

I2C data signal intended for connection to LED GPIO expansion circuitry on integrator's design. Refer to “LED Definitions” section for sample circuit diagram. This signal is also used for I2C connectivity to the expansion board (if present).2

40

SFP_GE1/2_RXLOS

I

3.3V LVTTL thresholds, PU

Loss of signal indication from standard SFP module corresponding to GigabitEthernet 1/2.

  • Logic low: Normal operation
  • Logic high: Optical receive strength too low

41

SFP_LED_I2C_SCL

O

3.3 V LVTTL thresholds

I2C clock signal intended for connection to MOD-DEF1 pin of standard SFP module connectors and to LED GPIO expansion circuitry. Buffer this signal as necessary for your design (depending on the number of loads and the layout). 3

48

CONSOLE_RTS

O

RS-232

Optional console port Request-to-Send signal. If not required, leave unconnected.

50

FACTORY_DEFAULT_INPUT_L

I

3.3 V LVTTL thresholds, PU
  • Logic low: Initiate factory default process
  • Logic high: Normal operation

52

CONSOLE_TXD

O

RS-232

Console port transmit data signal.

56

CONSOLE_RXD

I

RS-232

Console port receive data signal.

58

CONSOLE_CTS

I

RS-232

Optional console port Clear-to-Send signal. If not required, leave unconnected.

1.PU = Pull-up resistor present on board
OD=Open drain implementation

2.Trace should be no longer than 12 inches in length.

3.Buffering should be used on this line if there are over 8 loads present or the trace length is over 8 inches. Buffering can be performed unidirectionally since none of the downstream devices support I2C clock stretching. As an example, buffering could be done using a standard LVC245A device.

ESS-2020 (Main Board) Port Expansion Connector (P22)

The port expansion connector (P22) provides the interface between the main board and the expansion board. The connector is a TE Connectivity 7-5177986-2 60-pin connector. Table 4 provides a pinout listing for the port expansion connector on both the main board and the expansion board. See Figure 9 for the pin numbering convention.

note.gif

Noteblank.gif If the expansion card is not used in your application, this connector does not need to be used. It can simply be left unconnected.

 

Table 4 Cisco ESS-2020 (Main Board) and Cisco ESS-2020-16TC (Expansion Board) Port Expansion Connector (P22) Pinout

Main Board P22 Connector Pin Number
Signal Name
Expansion Board P22 Connector Pin Number

1

EXP_CLK_125MHZ

1

2

GND

2

3

GND

3

4

EXP_SYNC_P17_P24

4

5

EXP_TXD_P22

5

6

EXP_TXD_P24

6

7

EXP_TXD_P19

7

8

EXP_TXD_P23

8

9

EXP_TXD_P20

9

10

EXP_TXD_P21

10

11

EXP_TXD_P17

11

12

GND

12

13

EXP_TXD_P18

13

14

EXP_RXD_P19

14

15

GND

15

16

EXP_RXD_P21

16

17

EXP_RXD_P18

17

18

EXP_RXD_P24

18

19

EXP_RXD_P23

19

20

EXP_RXD_P22

20

21

EXP_RXD_P20

21

22

GND

22

23

EXP_RXD_P17

23

24

EXP_SYNC_P9_P16

24

25

GND

25

26

EXP_TXD_P15

26

27

EXP_RXD_P13

27

28

EXP_TXD_P16

28

29

EXP_TXD_P9

29

30

EXP_TXD_P13

30

31

EXP_RXD_P16

31

32

EXP_TXD_P14

32

33

EXP_RXD_P11

33

34

GND

34

35

GND

35

36

EXP_RXD_P15

36

37

EXP_RXD_P9

37

38

EXP_TXD_P12

38

39

EXP_RXD_P12

39

40

EXP_TXD_P11

40

41

EXP_RXD_P10

41

42

EXP_TXD_P10

42

43

EXP_RXD_P14

43

44

GND

44

45

GND

45

46

EXP_IRQ_L

46

47

EXP_RESET_L

47

48

Reserved. Leave unconnected. 1

48

49

EXP_TYPE0

49

50

Reserved. Leave unconnected. 1

50

51

EXP_TYPE1

51

52

EXP_ENABLE

52

53

EXP_TYPE2

53

54

EXP_PWRGOOD

54

55

GND

55

56

The main board P22 connector pin 56 should be unconnected.

The expansion board P22 connector pin 56 should be connected to the main board P15 connector, pin 39 (LED_EXP_I2C_SDA)4

56

57

EXP_MDIO

57

58

EXP_I2C_SCL

58

59

EXP_MDC

59

60

GND

60

4.You should connect all pins from the main board P22 connector and the expansion board P22 connector, except for pins 48, 50, and 56. No pull-up or pull-down resistors are required for the main board interconnect to the expansion board. All GND signals on each connector should connect to a common ground plane; not routed via a trace between the two connectors.

Table 5 provides the system integrator with notes about the signal groupings and the routing rules for signals on the P22 connector.

 

Table 5 P22 Connector Signal Integrator Notes

Signal Groupings
Description
Notes

EXP_CLK_125M

Serial Media Independent Interface (SMII) Clock signal from the main board to the expansion board.

These signals are considered high speed and are associated with the 125 MHz SMII bus between the main board and the expansion board. These signals should be routed according to the following rules:

  • All traces should be matched within 50 mils.
  • Trace length should be between 1 in (2.54 cm) and 3.5 in (8.89 cm), measured from the main board connector to the expansion board connector.
  • Traces should be routed over a continuous ground plane.
  • Trace impedance should be between 55–60 ohms.

EXP_SYNC_Px_Py

SMII sync signals from the main board to the expansion board.

EXP_TXD_Px

SMII transmit serial data from the main board to the expansion board.

EXP_RXD_Px

SMII receive serial data from the expansion board to the main board.

EXP_IRQ_L

Interrupt signal from the expansion board to the main board.

—

EXP_RESET_L

Reset signal from the main board to the expansion board.

—

EXP_ENABLE

Power enable signal from the main board to the expansion board.

Used to synchronize expansion board power sequencing.

EXP_PWRGOOD

Power good indication from the main board to the expansion board.

Used to synchronize expansion board power sequencing.

EXP_I2C_x

I2C bus (clock and data)

—

EXP_MDx

PHY MDIO bus (clock and data)

—

ESS-2020-16TC (Expansion Board) Interface Connectors

The locations and designations of the three expansion board connectors are shown in Figure 10.

Figure 10 Cisco ESS-2020-16TC (Expansion Board) Connectors

 

 

346651.eps

 

ESS-2020-16TC (Expansion Board) Ethernet I/O Connector (P10)

The expansion board Ethernet I/O connector (P10) is a TE Connectivity 7-5177986-4 100-pin connector. Table 6 provides a pinout listing for the connector. See Figure 10 for the pin numbering convention.

 

Table 6 Cisco ESS-2020-16TC (Expansion Board) Ethernet I/O Connector (P10) Pinout

Odd Pin Number
Signal
Even Pin Number
Signal

1, 3, 5, 7

Chassis_GND

 

2, 4, 6, 8

Chassis_GND

9, 11

Unused (NC)

 

10, 12

Unused (NC)

13

ETH_FE1/9_TX-

 

14

ETH_FE1/10_TX-

15

ETH_FE1/9_TX+

 

16

ETH_FE1/10_TX+

17

ETH_FE1/9_RX-

 

18

ETH_FE1/10_RX-

19

ETH_FE1/9_RX+

 

20

ETH_FE1/10_RX+

21

Unused (NC)

 

22

Unused (NC)

23

ETH_FE1/11_TX-

 

24

ETH_FE1/12_TX-

25

ETH_FE1/11_TX+

 

26

ETH_FE1/12_TX+

27

ETH_FE1/11_RX-

 

28

ETH_FE1/12_RX-

29

ETH_FE1/11_RX+

 

30

ETH_FE1/12_RX+

31

Unused (NC)

 

32

Unused (NC)

33

ETH_FE1/13_TX-

 

34

ETH_FE1/14_TX-

35

ETH_FE1/13_TX+

 

36

ETH_FE1/14_TX+

37

ETH_FE1/13_RX-

 

38

ETH_FE1/14_RX-

39

ETH_FE1/13_RX+

 

40

ETH_FE1/14_RX+

41

Unused (NC)

 

42

Unused (NC)

43

ETH_FE1/15_TX-

 

44

ETH_FE1/16_TX-

45

ETH_FE1/15_TX+

 

46

ETH_FE1/16_TX+

47

ETH_FE1/15_RX-

 

48

ETH_FE1/16_RX-

49

ETH_FE1/15_RX+

 

50

ETH_FE1/16_RX+

51

Unused (NC)

 

52

Unused (NC)

53

ETH_FE1/17_TX-

 

54

ETH_FE1/18_TX-

55

ETH_FE1/17_TX+

 

56

ETH_FE1/18_TX+

57

ETH_FE1/17_RX-

 

58

ETH_FE1/18_RX-

59

ETH_FE1/17_RX+

 

60

ETH_FE1/18_RX+

61

Unused (NC)

 

62

Unused (NC)

63

ETH_FE1/19_TX-

 

64

ETH_FE1/20_TX-

65

ETH_FE1/19_TX+

 

66

ETH_FE1/20_TX+

67

ETH_FE1/19_RX-

 

68

ETH_FE1/20_RX-

69

ETH_FE1/19_RX+

 

70

ETH_FE1/20_RX+

71

Unused (NC)

 

72

Unused (NC)

73

ETH_FE1/21_TX-

 

74

ETH_FE1/22_TX-

75

ETH_FE1/21_TX+

 

76

ETH_FE1/22_TX+

77

ETH_FE1/21_RX-

 

78

ETH_FE1/22_RX-

79

ETH_FE1/21_RX+

 

80

ETH_FE1/22_RX+

81

Unused (NC)

 

82

Unused (NC)

83

ETH_FE1/23_TX-

 

84

ETH_FE1/24_TX-

85

ETH_FE1/23_TX+

 

86

ETH_FE1/24_TX+

87

ETH_FE1/23_RX-

 

88

ETH_FE1/24_RX-

89

ETH_FE1/23_RX+

 

90

ETH_FE1/24_RX+

91, 93

Unused (NC)

 

92, 94

Unused (NC)

95, 97, 99

Chassis_GND

 

96, 98, 100

Chassis_GND
note.gif

Noteblank.gif The expansion board contains Ethernet transformers for all of the Fast Ethernet transmit/receive pairs for ports 1/9 through 1/24 (signals designated ETH_FE*).

note.gif

Noteblank.gif The Chassis_GND signal is not electrically connected to GND on the expansion card. Chassis_GND is used as the termination for the center taps on the Ethernet magnetics. You should either connect or not connect these signals together as needed for your specific application.

ESS-2020-16TC (Expansion Board) Power Connector (P11)

The expansion board power connector (P11) is a TE Connectivity 1-5179030-1 40-pin connector. Table 7 provides a pinout listing for the connector. See Figure 10 for the pin numbering convention.

 

Table 7 Cisco ESS-2020-16TC (Expansion Board) Power Connector (P11) Pinout
Pin Numbers
Signal Name

1, 3, 5, 7, 9,11, 13

+5 VDC

2, 4, 6, 8, 10, 12, 14

+3.3 VDC

15–20

Unused

21–40

GND

ESS-2020-16TC (Expansion Board) Port Expansion Connector (P22)

The port expansion connector provides the interface between the expansion board and the main board. The connector is a TE Connectivity 7-5177986-2 60-pin connector. Table 4 provides a pinout listing for the connector. See Figure 10 for the pin numbering convention.

Board to Board Connectors

Both the main board and the expansion board use the Free Height board-to-board connector family from TE Connectivity. Depending on the mating connector you select, a stacking height of 7 mm, 11 mm, or 15 mm can be achieved. Table 8 lists the board connectors and the mating connector options that are available to achieve specific stacking heights.

 

Table 8 Cisco ESS-2020 (Main Board) Connectors and Mating Connector Options
ESS-2020 Plug
Total Mated Height Desired (mm) 5
Mating Receptacle
Connector
TE Connectivity Part Number
Pins
Contact Plating
Height
(mm)
TE Part Number
Contact Plating
Height
(mm)
Delivery Method

P13

1-5179030-3

80

30µ" Au

3.2

15
15
11
11
7
7

5084618-3
5-6123212-3
7-5179180-3
5084613-3
5353999-3
6123000-3

30µ" Au

11.75
11.75
7.75
7.75
3.75
3.75

tape/reel
tube
tape/reel
tube
tape/reel
tube

P15, P22

7-5177986-2

60

30µ" Au

3.2

15
15
11
11
7
7

5084618-2
5-6123212-2
7-5179180-2
5084613-2
5353999-2
6123000-2

30µ" Au

11.75
11.75
7.75
7.75
3.75
3.75

tape/reel
tube
tape/reel
tube
tape/reel
tube

5.Offset distance between the ESS-2020 and motherboard, or other mating card.

 

Table 9 Cisco ESS-2020-16TC (Expansion Board) Connectors and Mating Connector Options
ESS-2020-16TC Plug
Total Mated Height Desired (mm) 6
Mating Receptacle
Connector
TE Connectivity Part Number
Pins
Contact Plating
Height
(mm)
TE Part Number
Contact Plating
Height
(mm)
Delivery Method

P11

1-5179030-1

40

30µ" Au

3.2

15
15
11
11
7
7

5084618-1
5-6123212-1
7-5179180-1
5084613-1
5353999-1
6123000-1

30µ" Au

11.75
11.75
7.75
7.75
3.75
3.75

tape/reel
tube
tape/reel
tube
tape/reel
tube

P22

7-5177986-2

60

30µ" Au

3.2

15
15
11
11
7
7

5084618-2
5-6123212-2
7-5179180-2
5084613-2
5353999-2
6123000-2

30µ" Au

11.75
11.75
7.75
7.75
3.75
3.75

tape/reel
tube
tape/reel
tube
tape/reel
tube

P10

7-5177986-4

100

30µ" Au

3.2

15
15
11
11
7
7

5084618-4
5-6123212-4
7-5179180-4
5084613-4
5353999-4
6123000-4

30µ" Au

11.75
11.75
7.75
7.75
3.75
3.75

tape/reel
tube
tape/reel
tube
tape/reel
tube

6.Offset distance between the ESS-2020-16TC and motherboard, or other mating card.

LED Definitions

LED functionality is provided by the main board through an I2C bus which you can connect to I2C General Purpose I/O (GPIO) expanders. You can select any combination of LEDs listed in Table 10 to implement; you are not required to implement all of the LEDs. Table 11 and Table 12 provide a listing of LED register bits for the system integrator.

 

Table 10 Available Cisco ESS-2020 Switch LED Functionality
LED
Color
Description

System

Off

Flashing Green

Green

Yellow

System is not powered on.

POST in progress.

System is operating normally.

System fault detected.

Power

Off

Green

Power is not present or unit failed memory test.

System is powered on.

Overtemperature

Off

Yellow

Board temperature is within specified operating range.

Board temperature exceeding specified operating range.

Port

Off

Green

Flashing green

Alternating green and yellow


Yellow

No link or the port was administratively shut down.

Link is present; no activity

Activity. The port is sending or receiving data.

Link fault. Error frames can affect connectivity. Errors such as excessive collisions, cyclic redundancy check (CRC), and alignment and jabber errors are monitored for link-fault indication.

Port is disabled

Factory default

Off

Flashing green

Yellow

Green

Normal operation.

Factory default procedure has been initiated.

Factory default procedure has completed; switch is about to reboot.

Factory default procedure has completed.

 

Table 11 I2C GPIO Expanders

Register Name (I2C Addr)
Bit
System Ctrl (0x40)
GE_Combo_Ctrl (0x42)
FE 1-8_Green_Ctrl (0x44)
FE 1-8_Yellow_Ctrl (0x46)

7

N/A

GE1/2_RJ_Yel

FE1/1_Gr

FE1/1_Yel

6

PwrGood_Gr

GE1/2_RJ_Gr

FE1/2_Gr

FE1/2_Yel

5

System_Yel

GE1/2_SFP_Yel

FE1/3_Gr

FE1/3_Yel

4

System_Gr

GE1/2_SFP_Gr

FE1/4_Gr

FE1/4_Yel

3

FactoryDef_Yel

GE1/1_RJ_Yel

FE1/5_Gr

FE1/5_Yel

2

FactoryDef_Gr

GE1/1_RJ_Gr 1

FE1/6_Gr

FE1/6_Yel

1

OverTemp_Yel

GE1/1_SFP_Yel

FE1/7_Gr

FE1/7_Yel

0

N/A

GE1/1_SFP_Gr

FE1/8_Gr

FE1/8_Yel

 

Table 12 I2C GPIO Expanders (Part 2)

Register Name (I2C Addr)
Bit
FE 9-16_Green_Ctrl (0x48)
FE 9-16_Yellow_Ctrl (0x4A)
FE 17-24_Green_Ctrl (0x4C)
FE 17-24_Yellow_Ctrl (0x4E)

7

FE1/9_Gr

FE1/9_Yel

FE1/17_Gr

FE1/17_Yel

6

FE1/10_Gr

FE1/10_Yel

FE1/18_Gr

FE1/18_Yel

5

FE1/11_Gr

FE1/11_Yel

FE1/19_Gr

FE1/19_Yel

4

FE1/12_Gr

FE1/12_Yel

FE1/20_Gr

FE1/20_Yel

3

FE1/13_Gr

FE1/13_Yel

FE1/21_Gr

FE1/21_Yel

2

FE1/14_Gr

FE1/14_Yel

FE1/22_Gr

FE1/22_Yel

1

FE1/15_Gr

FE1/15_Yel

FE1/23_Gr

FE1/23_Yel

0

FE1/16_Gr

FE1/16_Yel

FE1/24_Gr

FE1/24_Yel

Figure 11 shows an example of an LED driver circuit for use with the board.

Figure 11 Example LED Driver Circuit

 

347288.tif

Mechanical and Environmental Testing

The tests listed in Table 13 were successfully executed on the conduction-cooled models of the Cisco ESS-2020 and Cisco ESS-2020-16TC. These tests used a representative enclosure that conforms to the mounting and thermal mechanisms shown in Figure 12. Because this type of testing is highly dependent on factors such as the test enclosure design, the thermal solution, the front panel connectors, and the mounting, the following test results should only be used as a reference.

 

Table 13 Mechanical/Environmental Test Results
Temperature

High and Low Temperature Cycle Stress

(Operational)

High Temperature: 74°C (165°F)

Low Temperature: -40°C (-40°F)

Reference: MIL-STD-810F, Method 501.4, Procedure II and Method 502.4, Procedure II; SAE J1455 (Rev AUG94), Section 4.1.3

Thermal Shock

(Non-Operational)

High Temperature: 85°C (185 °F)

Low Temperature: -40°C (-40 °F)

Cycle: 2 hours high temperature, 2 hours low temperature

Test Period: 2 hour pre-soak at low temperature, followed by 5 cycles

Repetition: 5 test periods

Reference: MIL-STD-810F, Method 503.4; SAE J1455 (Rev AUG94), Section 4.1.3.2

High Temperature Component Thermal Test

(Operational)

Method: Thermocouples on all critical/hot components at board level. Bring temperature of top center surface of thermal plate to 85°C (185 °F) and allow it to stabilize. Ensure that all components are within manufacturer thermal specifications.
Altitude

Low Pressure/Altitude

(Operational)

Altitude: 4,572m (15,000ft)

Equivalent Absolute Pressure: 57.2 kPa (8.3 lbf/in2)

Temperature: -40°C (-40°F) to 74°C (165°F)

Altitude Ramp Rate: 10m/s (max)

Temperature Ramp Rate: 1.5°C (min) to 4.5°C (max)

Reference: MIL-STD 810F, Method 500.4, Procedure II; SAE J1455 (Rev AUG94), Section 4.1.3.1

Low Pressure/Altitude

(Non-Operational)

Altitude: 12.2km (40,000 ft)

Equivalent Absolute Pressure: 18.6kPa (2.7lbf/in2)

Temperature: -40°C (-40°F) to 85°C (185°F)

Altitude Ramp Rate: 10m/s (max)

Temperature Ramp Rate: 1.5°C (min) to 4.5°C (max)

Reference: MIL-STD-810F, Method 500.4; SAE J1455 (Rev AUG94), Section 4.1.3.1
Humidity

Temperature & Humidity Cycle Stress

(Non-Operational; Energized)

Humidity: 95% +/- 5% RH

Pressure: 103.4 kPa (15 lbf in2)

Temperature: -40°C (-40°F) to 65°C (149°F)

Cycle: One, 24 hour cycle

Reference: SAE J1455 (Rev AUG94), Section 4.2.3

Active Temperature/Humidity

10 Day Soak

(Non-Operational; Energized)

Temperature: -40°C (-40°F) to 65 °C (149 °F)

Humidity: 95% +/- 5% RH

Cycle: Ramp from 25°C to -40°C over 75 minute period, dwell at -40°C for 240 minutes, ramp to 65°C over 120 minute period, dwell at 65°C for 240 minutes (95% +/- 5% RH), ramp to 25°C over 45 minute period, dwell at 25°C for 120 minutes (50% +/- 5% RH)

Repetition: 20 total cycles (10 days total)

Reference: MIL-STD-810F, Method 507.4; SAE J1211 (Rev NOV78), Section 4.2.2; SAE J1455 (Rev AUG94), Section 4.2.3
Vibration

Random Vibration

(Operational)

Acceleration: 1.04g rms vertical, 0.204g rms transverse, 0.740g rms longitudinal

Duration: 2 hours per axis

Test orientation: 3 axes

Reference: MIL-STD-810F, Method 514.5, Category 4
Shock

Crash Hazard Shock

(Non-Operational)

Acceleration: 75G

Duration: 8-13ms

Test orientation: 3 axes (positive and negative)

Number of shocks: 2 shocks in each direction, 12 shocks total

Reference: MIL-STD-810F, Method 516.5, Procedure V

Functional Shock

(Operational)

Acceleration: 40G

Duration: 15-23ms

Test orientation: All 6 faces, in 3 perpendicular axes

Reference: MIL-STD-810F, Method 516.5, Procedure I

Bench handling shock (tip)

(Operational)

Test orientation: All four edges of each face to form 10° angle with bench top

Reference: MIL-STD-810F, Method 516.5, Procedure VI

Factory Default Feature

To enable the factory default feature for the Cisco ESS-2020, the service-declassify command must be configured to one of the two enabled states. The factory default feature is disabled by default. Table 14 lists the settings and completion times for the factory default capability option.

 

Table 14 Settings and Completion Time for Factory Default Capability Options
Option
Action
Typical Completion Time

erase-config

Removes all configuration files from the device. This option leaves other non-configuration files intact.

Variable (less than 2 minutes)

erase-flash

Completely formats the flash filesystem. This also removes any IOS images present.7

Variable8

7.For the unit to function normally, the IOS needs to be reloaded by using xmodem from the bootloader prompt. Typical image load time is 20 to 25 minutes using a 115.2 kbaud console link (slower console links will increase the load time).

8.The erase time is between 12 and 14 minutes, depending on the flash memory vendor.

To initiate factory default, the signal FACTORY_DEFAULT_INPUT_L located on the main board connector P15, pin 50 must be grounded. While the process is executing, the FactoryDef_Gr LED flashes green. When the factory default process is complete, the FactoryDef_Yel LED lights indicating that the system is rebooting. The system stops at the bootloader prompt with the FactoryDef_Gr LED lit green indicating that the default procedure has successfully completed.

note.gif

Noteblank.gif After the factory default procedure completes, there will be an empty file in the filesystem. This file is deleted the next time that IOS is booted.

eMMC is a managed NAND. This means that our embedded switch or router system does not interact with the flash memory directly. The flash controller presents a block-style interface to our system, and it handles the flash management (analogous to the Flash Translation Layer). Our embedded switch or router system cannot access the raw flash directly.

The JEDEC standard has commands that are supposed to remove data from the raw flash. In Cisco’s implementation, the “Erase” and “Sanitize” commands are used. The eMMC standard JESD84-B51 defines “Sanitize” as follows:

The Sanitize operation is a feature … that is used to remove data from the device according to Secure Removal Type. The use of the Sanitize operation requires the device to physically remove data from the unmapped user address space.

After the sanitize operation is completed, no data should exist in the unmapped host address space.

note.gif

Noteblank.gif Zeroization does NOT erase removable media such as SD Card and USB Storage. This media must be removed from the system and erased or destroyed using procedures that are outside the scope of this document.

Important Notice about Zeroization

Zeroize does a very thorough wipe of all non-protected parts of the eMMC flash using the best technology designed by the flash manufacturer today and can do so using the push of a button without the need for a console, ssh, or management session of any kind. It is the integrator's and end user's responsibility to determine the suitability regardless of the CLI keyword used to enable the feature.

Note : While Cisco IOS and Cisco IOS-XE use the command line text of “declassify” in the command line interface (CLI) to enable the zeroize feature, in no way does this represent any specific endorsement or acknowledgment of a Government approved flash erasure methodology.

Declassification procedures are unique to each Government organization. Cisco solely provides the technical detail of the erasure operation here, not the policy distinction or any specific recommendation per classification.

Please refer to your respective Government Agency policies, procedures, and recommendations for the handling of sensitive data to see if this procedure meets with those requirements.

Overtemperature Detection

Both the main board and the expansion board have a temperature sensor mounted in the middle of the board. When the temperature sensor on either the main board or the expansion board detects a temperature exceeding the temperature threshold of 203°F (95°C), the overtemperature LED will illuminate.

note.gif

Noteblank.gif Even though the overtemperature threshold has been exceeded and the overtemperature LED is lit, the boards will continue to operate, but damage to the components might occur.

The status of the temperature sensors can be reported from the Cisco ESS-2020 IOS CLI:

Switch# show environment all
SYSTEM TEMPERATURE is OK
System Temperature Value: 36 Degree Celsius
Extension Board Temperature Value: 32 Degree Celsius

Thermal Design Considerations

The following sections outline the methods for dealing with thermal issues and the mounting options involving the Cisco-designed conduction cooling plate.

Models with Thermal Plate

As the Cisco ESS 2020 is intended for use in extreme environments, industrial temperature rated components are used. The models with a thermal plate (-CON) make integration easier by abstracting the component level thermal concerns. Cisco has already performed the thermal analysis at the component level so that the integrator need only be concerned with the thermal plate temperature. As a general rule, the thermal plate of the card needs to make contact with an adequate thermal mass to draw heat away from the card. This can be done in a number of ways. An example is shown in Figure 12.

In this example, the Cisco ESS 2020 transfers heat away from its thermal plate and into the enclosure wall by utilizing a “shelf” of metal. This shelf encompasses the entire Cisco ESS 2020 thermal plate surface. The same concept could be shown by interfacing the Cisco ESS 2020 thermal plate directly to the enclosure wall (via thermal interface material).

The important note is that the thermal plate temperature, as measured at the center of the top surface of the thermal plate, must not exceed 85° C. As long as this requirement is satisfied, all of the card's components will be within a safe operating temperature range on the high temperature side.

Figure 12 Example of Thermal Solution in an Enclosure

 

347336.eps

 

1

Shelf of metal carrying heat to enclosure wall
5

Thermal interface material
2

Mounting stand-off

6

Thermal plate

3

ESS-2020 plug board-to-board connector
7

Temperature reference point
4

Receptacle board-to-board connector
8

Motherboard example

Heat dissipation methods:

As a general rule, the thermal plate of the board needs to make contact with an adequate thermal mass to draw heat away from the board. There are many ways to achieve this goal.

Examples:

  • Transfer heat away from the thermal plate and into the enclosure wall by utilizing a “shelf” of metal. The shelf encompasses the entire Cisco ESS 2020 thermal plate surface. This shelf is illustrated by item 1 in Figure 12.
  • Mount the Cisco ESS 2020 thermal plate directly to the enclosure wall by using thermal interface material.
  • Attach card retainers to the extended edges of the thermal plate. The board retainers would then make contact with a thermal mass or the enclosure where the heat from the Cisco ESS 2020 will be conducted. For more information, see Mounting Options for the Cisco-Designed Thermal Plate.

Models Without Thermal Plate

The Cisco ESS-2020 -NCP models are not equipped with a Cisco-designed thermal plate. These models are not intended to be operated without some type of thermal plate, or similar, solution. In the event that you intend to design a custom cooling solution, the following component-level thermal information is provided to assist in the effort. The thermally significant components of the main card are illustrated in Figure 13 and described in Table 15 . The thermally significant components of the expansion card are illustrated in Figure 14 and described in Table 16 .

Figure 13 Thermally Significant Components of Cisco ESS-2020 (Main Card)

 

347337.eps

Table 15 Thermal Details for the Thermally Significant Components of Cisco ESS 2020 (Main Card)
Thermal Design Power (in W)
Allowable junction temp (in degC)
Allowable case temp (in degC)
Package Characteristics
Package Type
Theta Jc (in degC/W)
Theta Jb (in degC/W)
U2, U3, U4

0.29 each

Not given

95

FBGA84

5.6

32.3
U8

0.1

Not given

Not given

FBGA64

-

-
U7

1.22

125

105

PBGA537

5.58

7.85
U5

1.23

125

105

MQFP128

29.74

1.75
U6

1.38

125

109

FBGA121

12.32

15.35
U44

1.32

120

100

EPBGA456

9.62

14.59
note.gif

Noteblank.gif U13 is the Cisco ESS-2020 (main card) thermal sensor.

Figure 14 Thermally Significant Components of Cisco ESS-2020-16TC (Expansion Card)

347338.eps

Table 16 Thermal Details for the Thermally Significant Components of Cisco ESS-2020-16TC (Expansion Card)
Thermal Design Power (in W)
Allowable junction temp (in degC)
Allowable case temp (in degC)
Package Characteristics
Package Type
Theta Jc (in degC/W)
Theta Jb (in degC/W)
U5, U41

1.23

125

105

MQFP128

29.74

1.75
note.gif

Noteblank.gif U43 is the Cisco ESS-2020-16TC (expansion card) thermal sensor.

Validating a Thermal Solution

To validate a thermal solution, monitor the thermal sensor of the Cisco ESS 2020 cards in a thermal chamber set to the desired maximum ambient operating temperature and with traffic running.

Each card has a single sensor located near the center of the card, which makes contact with the thermal plate using thermal interface material. The temperature of the sensors should be less than 90.5C. The show environment all command can be executed from the IOS prompt to monitor the thermal sensor temperatures

Switch# show environment all
SYSTEM TEMPERATURE is OK
System Temperature Value: 36 Degree Celsius
Extension Board Temperature Value: 32 Degree Celsius

Mounting Options for the Cisco-Designed Thermal Plate

Several mounting options are viable for the –CON SKUs. One method is to use standoffs and screws through the mounting holes in the thermal plate “extensions” to retain the Cisco ESS-2020 boards to a motherboard. This method is shown in Figure 12. When using this method, the integrator must be certain to use a standoff height that is designed for the mated pair of I/O connectors that is chosen.

The integrator may also find it helpful to use threaded mounting holes in the top of the thermal plate to hold the card’s thermal plate to an enclosure wall or even to a larger thermal plate. These threaded mounting holes are shown in Figure 15. This figure also shows the locations for connecting the cards to commercially available card retainers.

Figure 16 illustrates the card retainer mounting concept. These card retainers hold the board inside a chassis (via slots) and transfer heat away from the Cisco ESS-2020 thermal plate.

note.gif

Noteblank.gif It is important to note that the card retainer is NOT orderable from Cisco.
In figure 16, the card retainer is provided by the Integrator.

Figure 15 Mounting Holes for the Cisco-Designed Thermal Plate (Main Card and Expansion Card)

347339.eps

 

 

1

Intended for connection to thermal mass
2

Intended for mounting to motherboard via standoffs and screws
3

Intended for mounting to card retainers
 

 

Figure 16 Example of Card Retainer Attached to Cisco-Designed Thermal Plate

 

347340.jpg

 

Specifications for card retainers:

The Cisco ESS-2020 thermal plate card retainer mounting features are intended for card retainers that conform to the following specifications. The recommended mounting hardware is 2-56 x 3/16-inch flat head machine screws, preferably with a nylon locking patch or Loctite to secure the hardware in place.

  • Width: 0.225 inches
  • Number of mounting holes: 2
  • Mounting hole style: 2-56 threads
  • Distance between mounting holes = 1.400 inches

Sandwich Configuration

The following figure shows a conceptual drawing of a Cisco ESS 2020 main board combined with a Cisco ESS 2020 expansion board with a “sandwich board” in the middle. All interconnects between the main board and the expansion board are via the sandwich board; also, all user I/O (Ethernet ports, console, etc.) is via the sandwich board.

note.gif

Noteblank.gif It is important to note that the sandwich configuration is conceptual, and contains components that are NOT orderable from Cisco.
In figure 17, the I/O Board Mounting Bracket, I/O PCA, and the Sandwich Board are all components that are provided by the Integrator.

Figure 17 Sandwich Configuration

 

347591.jpg

Product Specifications

Table 17 lists the product specifications for the Cisco ESS 2020.

 

Table 17 Product Specifications
Interface Support

ESS-2020

2 GE (copper or fiber)

8 FE (copper)

RS-232 console port

ESS-2020-16TC

16 FE
Memory 9

DRAM

256MB

Flash

64MB
Environmental

Industrial-grade components

-40degF to +185degF (-40degC to +85degC) component local ambient temperature specifications

Operating temperature
  • -40degF to +185degF (-40degC to +85degC) as measured at the center of the top surface of the –CON SKU thermal plate.
  • Temperature range of a completed solution depends on the enclosure thermal design characteristics used by the integrator.
  • If –NCP SKU is used, integrator is responsible for designing a thermal solution that meets the component level requirements provided in this document.

Non-Operating Temperature

-40degF to +185degF (-40degC to +85degC)

Operating altitude

15,000ft (4,572m)

Non-operating altitude

40,000ft (12,200m)

Humidity

95% +/- 5% RH
Hardware Specifications

Input voltages

+5Vdc (+/- 5%) and +3.3Vdc (+/- 5%)

Total Power

Typical

  • ESS-2020 (base card): 6.5W
  • ESS-2020-16TC (expansion): 3.6W

Maximum

  • ESS-2020 (base card): 8.0W
  • ESS-2020-16TC (expansion): 4.7W

Weight

ESS-2020-CON: 23.0 ounces

ESS-2020-16TC-CON: 21.6 ounces

ESS-2020-NCP: 2.3 ounces

ESS-2020-16TC-NCP: 2.1 ounces

MTBF10

(Mean Time Before Failure)

ESS-2020 (-CON and –NCP)

  • Ground, Fixed, Controlled: 1,899,080 (in hours)
  • Ground, Mobile: 474,770 (in hours)

ESS-2020-16TC (-CON and –NCP)

  • Ground, Fixed, Controlled: 2,408,980 (in hours)
  • Ground, Mobile: 602,245 (in hours)

ESS-2020 combined with ESS-2020-16TC (-CON and –NCP)

  • Ground, Fixed, Controlled: 1,136,670 (in hours)
  • Ground, Mobile: 284,168 (in hours)

9.All memory physically located on Cisco ESS-2020 main board.

10.Values were determined by using Cisco-adopted Telcordia spec SR-332 Issue 3, Sept. 2011 (Reliability Prediction Procedures for Electronic Equipment).

Power Requirements

Both the main board and the expansion board require +5 VDC and +3.3 VDC to operate. Table 18 lists the DC power requirements for the main board and the expansion board.

 

Table 18 Power Requirements for the Main Board and the Expansion board
Board
Power Requirements

Main board

 

DC-input voltage rails
  • +5 VDC (±5 percent)
  • +3.3 VDC (±5 percent)

DC-input current
  • +5 VDC: 0.93 A (max), 0.76 A (typical)
  • +3.3 VDC: 1.00 A (max), 0.82 A (typical)

Power
  • +5 VDC: 4.65 W (max), 3.80 W (typical)
  • +3.3 VDC: 3.30 W (max), 2.71 W (typical)

Expansion board

 

DC-input voltage rails
  • +5 VDC (±5 percent)
  • +3.3 VDC (±5 percent)

DC-input current
  • +5 VDC: 0.80 A (max), 0.65 A (typical)
  • +3.3 VDC: 0.20 A (max), 0.10 A (typical)

Power
  • +5 VDC: 4.00 W (max), 3.25 W (typical)
  • +3.3 VDC: 0.66 W (max), 0.33 W (typical)
note.gif

Noteblank.gif There are no voltage rail-sequencing requirements. Power supply voltage rails can power-up or power-down in any order. Both +3.3 VDC and 5 VDC rails are required by the ESS-2020.

SFP Support

Both 100BASE-X and 1000BASE-X SFP transceivers are supported by the two main board combo ports. Table 19 lists the specific SFP transceivers and their characteristics.

 

Table 19 SFP Support for the Cisco ESS-2020

SFP Transceiver
Wavelength (nanometers)
Fiber Type
Core Size 11 (microns)
Modal Bandwidth
Cabling Distance
Industrial and Rugged SFPs (Operating temperature range: -40F to 185F (-40C to 85C))

GLC-SX-MM-RGD

(1000BASE-SX)

850

MMF

62.5

62.5

50

50

50

160

200

400

500

2000

722 feet (220 m)

902 feet (275 m)

1640 feet (500 m)

1804 feet (550 m)

3281 feet (1 km)

GLC-LX-SM-RGD

(1000BASE-LX/LH)

1310

MMF12

SMF

62.5

50

50

G.652

500

400

500

—

1804 feet (550 m)

1804 feet (550 m)

1804 feet (550 m)

32,810 feet (10 km)

GLC-FE-100LX-RGD

(100BASE-LX10)

1310

SMF

G.652

—

32,810 feet (10 km)

GLC-FE-100FX-RGD

(100BASE-FX)

1310

MMF

62.5

62.5

50

50

160

200

400

500

6,562 feet (2 km)

GLC-ZX-SM-RGD

(1000BASE-ZX)

1550

SMF

G.652

—

Approximately 70km (depending on link loss)
Commercial SFPs (Operating temperature range: 32F to 158F (0C to 70C))

GLC-BX-D13

(1000BASE-BX10-D)

TX 1490

RX 1310

SMF

G.652

—

32,810 feet (10 km)

GLC-BX-U 3

(1000BASE-BX10-U)

TX 1310

RX 1490

SMF

G.652

—

32,810 feet (10 km)

CWDM-SFP

1470, 1490, 1510, 1530, 1550, 1570, 1590, 1610

SMF

G.652

—

62 miles (100 km)

DWDM-SFP

1561.42, 1560.61, 1559.79, 1558.98, 1558.17, 1557.36, 1556.55, 1555.75, 1554.94, 1554.13, 1553.33, 1552.52, 1551.72, 1550.92, 1550.12, 1549.32, 1548.51, 1547.72, 1546.92, 1546.12, 1545.32, 1544.53, 1543.73, 1542.94, 1542.14, 1541.35, 1540.56, 1539.77, 1538.98, 1538.19, 1537.40, 1536.61, 1535.82, 1535.04, 1534.25, 1533.47, 1532.68, 1531.90, 1531.12, 1530.33

SMF

G.652

—

Distance is based on a guaranteed power budget of 25 dB

GLC-LH-SM14

(1000BASE-LX/LH)

1310

MMF 2

SMF

62.5

50

50

G.652

500

400

500

—

1804 feet (550 m)

1804 feet (550 m)

1804 feet (550 m)

32,810 feet (10 km)

GLC-SX-MM 4

(1000BASE-SX)

850

MMF

62.5

62.5

50

50

50

160

200

400

500

2000

722 feet (220 m)

902 feet (275 m)

1640 feet (500 m)

1804 feet (550 m)

3281 feet (1 km)
Extended Temperature SFPs (Operating temperature range: 23F to 185F (-5C to 85C))

SFP-GE-L

(1000BASE-LX/LH)

1310

MMF 2

SMF

62.5

50

50

G.652

500

400

500

—

1804 feet (550 m)

1804 feet (550 m)

1804 feet (550 m)

32,810 feet (10 km)

SFP-GE-S

(1000BASE-SX)

850

MMF

62.5

62.5

50

50

50

160

200

400

500

2000

722 feet (220 m)

902 feet (275 m)

1640 feet (500 m)

1804 feet (550 m)

3281 feet (1 km)

SFP-GE-Z

(1000BASE-ZX)

1550

SMF

G.652

—

Approximately 70km (depending on link loss)

GLC-EX-SMD

(1000BASE-EX)

1310

SMF

G.652

—

131,240 feet (40 km)

GLC-FE-100LX

(100BASE-LX10)

1310

SMF

G.652

—

32,810 feet (10 km)

GLC-FE-100BX-D

(100BASE-BX10-D)

TX 1550

RX 1310

SMF

G.652

—

32,810 feet (10 km)

GLC-FE-100BX-U

(100BASE-BX10-U)

TX 1310

RX 1550

SMF

G.652

—

32,810 feet (10 km)

GLC-FE-100FX

(100BASE-FX)

1310

MMF

62.5

62.5

50

50

160

200

400

500

6,562 feet (2 km)

GLC-FE-100EX 3

(100BASE-EX)

1310

SMF

G.652

—

131,240 feet (40 km)

GLC-FE-100ZX

(100BASE-ZX)

1550

SMF

G.652

—

262,480 feet (80 km)

GLC-SX-MMD

(1000BASE-SX)

850

MMF

62.5

62.5

50

50

50

160

200

400

500

2000

722 feet (220 m)

902 feet (275 m)

1640 feet (500 m)

1804 feet (550 m)

3281 feet (1 km)

GLC-LH-SMD

(1000BASE-LX/LH)

1310

MMF 2

SMF

62.5

50

50

G.652

500

400

500

—

1804 feet (550 m)

1804 feet (550 m)

1804 feet (550 m)

32,810 feet (10 km)

11.G.652, listed under core size for single mode fiber (SMF), refers to ITU-T G.652 SMF as specified by the IEEE 802.3z standard.

12.A mode-conditioning patch cord is required at all times per IEEE specifications, regardless of the span length.

13.Version -02 or later

14.Version -03 or later

Regulatory Compliance and Safety Information

Statement 8000—Standards Compliance

The ESS 2020 and ESS 2020-16TC were installed in a representative chassis, tested, and shown to meet the standards listed in Table 20 . Individual results will depend on final implementation. Formal compliance testing must be performed by the integrator in a fully assembled product.

 

Table 20 Standards Compliance

Specification
Description

Safety
  • UL 60950-1 Recognized Component (R/C)
  • CSA22.2-No. 60950-1
  • EN60950-1
  • IEC60950-1

EMC
  • FCC Part 15 Class A
  • ICES-003 Class A
  • EN55022 Class A
  • EN55024

Obtaining Documentation and Submitting a Service Request

For information on obtaining documentation, submitting a service request, and gathering additional information, see the monthly What’s New in Cisco Product Documentation, which also lists all new and revised Cisco technical documentation:

http://www.cisco.com/en/US/docs/general/whatsnew/whatsnew.html

Subscribe to the What’s New in Cisco Product Documentation as an RSS feed and set content to be delivered directly to your desktop using a reader application. The RSS feeds are a free service. Cisco currently supports RSS Version 2.0.

ESS-2020_tg_ol-28824-22.jpg
Cisco and the Cisco logo are trademarks or registered trademarks of Cisco and/or its affiliates in the U.S. and other countries. To view a list of Cisco trademarks, go to this URL: www.cisco.com/go/trademarks. Third-party trademarks mentioned are the property of their respective owners. The use of the word partner does not imply a partnership relationship between Cisco and any other company. (1110R)

© 2013 Cisco Systems, Inc. All rights reserved.

 

ESS-2020_tg_ol-28824-23.jpg

Was this Document Helpful?

FeedbackFeedback

Contact Cisco

This Document Applies to These Products