Research at Cisco

Photonics on Silicon, optical on Silicon

Project ID:


RFP-2012-073

Title:


Photonics on Silicon, optical on Silicon

Summary:


Internet applications, collaboration tools; video streaming/conferencing and HPC applications are proliferating at an unprecedented rate. This is creating an interesting demand for the speed and bandwidth. Moving forward, this will have tremendous consequences on the design of products. While the channel density, the speed/bandwidth and number of interconnects will increase; the real estate that designers deal will remain the same in cases be reduced, in addition to more demand to lower the power consumption and cost involved in using exotic materials to improve the signal and power integrity. These contradicting needs are not easy to solve without compromises in the actual design. Moving from electrical to optical is more likely the easy path to answer all the questions and concerns.

Full Description:


Internet applications, collaboration tools; video streaming/conferencing and HPC applications are proliferating at an unprecedented rate. This is creating an interesting demand for the speed and bandwidth. Moving forward, this will have tremendous consequences on the design of products. While the channel density, the speed/bandwidth and number of interconnects will increase; the real estate that designers deal will remain the same in cases be reduced, in addition to more demand to lower the power consumption and cost involved in using exotic materials to improve the signal and power integrity. These contradicting needs are not easy to solve without compromises in the actual design. Moving from electrical to optical is more likely the easy path to answer all the questions and concerns. Optical interconnects using fiber are already in use and provide several advantages. The next logical trend is to do more integration using optical waveguides into PCB leading to hybrid architectures and also move to silicon photonics to enable a much more powerful chip to chip interfaces exceeding the 25Gb/s per channel. While many photonics components are available on the market to align with the industry trends; they tend to be more isolated and don't address Cisco needs.

To better understand the integration at the silicon level or PCB side research is needed to validate the next generation photonics development. Here we propose to extend academia research and collaboration on the following areas related to Photonic on Si or PCB: heterogeneous integration and interface, reliability assessment, package technology, as well as test.

Constraints and other information:


Cisco expects customary scholarly dissemination of results, and hopes that promising results would be made available to the community without limiting licenses, royalties, or other encumbrances.

Proposal submission:


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RFPs may be withdrawn as research proposals are funded, or interest in the specific topic is satisfied.
Submissions are batched and reviewed at the beginning of each calendar quarter in January, April, July, and October.

Questions? Contact: research@cisco.com